LPDDR4 PCB Layout Guidelines

Route LPDDR4 and LPDDR4X at 40 Ω single-ended (80 Ω differential for CK and DQS), point to point with no board termination or VTT rail; keep each strobe shorter than its data lines, the clock longer than every strobe, and every route under 450 ps.

Every rule below comes from a chip vendor’s layout guide or data sheet, each named in the sources; none is quoted from the LPDDR4 specification itself. Vendor guides differ, so treat their numbers as good practice and follow your own device’s guide where it is stricter.

Key numbers

QuantityLPDDR4 / LPDDR4X (up to 4266 MT/s)
Line rate4.266 Gb/s
Nyquist frequency2.133 GHz
EncodingSingle-ended low-voltage swing terminated logic, double data rate
Impedance40 Ω single-ended (36–44 Ω)
Second impedanceCK and DQS pairs (differential)
DQS intra-pair skew1.5 ps
Longest route (delay)450 ps
  • TI and Efinix use 40 Ω; AMD uses 39 Ω (UltraScale) or 45 Ω (Versal).

Routing rules

Point-to-point low-power DDR: no board termination, per-bit deskew in the PHY.

RuleRequirementBasis
Impedance40 Ω single-ended ±10 %, 80 Ω differential for CK and DQS. LPDDR4 and LPDDR4X are routed identically.Vendor guide [1]
DQ to DQSTI allows −49 to +2 ps: the strobe should be shorter than every data line in its byte.
The window is asymmetric on purpose, so a length-matching tool set to match symmetrically will break it. AMD allows ±5 ps (UltraScale) or ±100 ps (Versal).
Vendor guide [1]
CK to DQSThe clock pair must be longer than every strobe pair, by 0 to 150 ps.Vendor guide [1]
Address and command to CKWithin ±312.5 ps at TI; AMD Versal asks for ±100 ps on the command bus and ±20 ps on the chip-select and clock-enable lines.Vendor guide [1]
Route delayClock, address, strobe and data all stay under 450 ps. AMD Versal gives it as 3600 mil on inner layers only.Vendor guide [1]
TerminationNone on the board: everything is point-to-point and terminated on-die. No VTT rail, and no VREF routing either.
This is the big difference from DDR4, and it is why LPDDR4 layouts are so much smaller.
Vendor guide [1]
DeskewPer-bit deskew in the PHY loosens the tolerances substantially, which is why LPDDR4 windows are wider than DDR4 ones.Vendor guide [1]
Vias and stubsTwo vias per data trace, three on clock and address, equal counts within a group, via stubs under 20 mil on clock and address and under 40 mil on data. Return vias within 250 mil.
Signals with a via near the SoC must not also have a via near the memory.
Vendor guide [1]
Spacing5W from a clock or strobe to anything else, 3W inside the address group and inside a byte; 2W for up to 500 mil near the ends.Vendor guide [1]
Reference planeNo plane cuts in the routing area, plane directly adjacent to the signal layer, stripline strongly preferred.Vendor guide [1]

Check LPDDR4 / LPDDR4X (up to 4266 MT/s) on your own stackup → The interface rules tool designs the trace for this impedance on a layer you choose and turns every limit above into a length on that board.

Related guides

Sources

  1. TI SPRAD06C — AM62x, AM62Lx DDR Board Design and Layout Guidelines (rev. March 2025). Tables 3-6 and 3-7: 40 Ω / 80 Ω ±10 %, 1.5 ps DQS intra-pair, the −49 to +2 ps data-to-strobe window, 0–150 ps clock-to-strobe ordering, 450 ps route limits, 5W/3W spacing, via and stub limits, and §3.9–3.13 on the absence of VTT and VREF.
  2. AMD UG863 — Versal Adaptive SoC PCB Design User Guide, LPDDR4/4x rules. 45 Ω single-ended and 82 Ω differential ±10 %, ±100 ps data-to-strobe, 0–2 ps intra-pair, 3600 mil inner-layer routing, and spacing expressed in dielectric heights.
  3. Efinix UG-PCB-DDR-TI v1.2 — Titanium DDR DRAM PCB Design User Guide. 40 Ω / 80 Ω ±10 % for LPDDR4 and LPDDR4X alike, 75 ps byte skew, 350 ps clock-to-strobe, 250 mil return vias, and 3× width spacing on FR-4 stripline.

Layout guidelines for other interfaces

HDMI · DisplayPort · USB 3.2 · USB 2.0 · DDR4 · RGMII · RMII · SGMII · 1000BASE-T Ethernet · MIPI D-PHY · SATA · PCIe