PCB design calculators

Single-ended and differential microstrip, coated and embedded microstrip, stripline and coplanar lines, solved with a 2D field solver.

Propagation delay, length matching from skew, rise time to bandwidth, critical length and wavelength.

Insertion loss in dB/in and over the full length: conductor loss with copper roughness and dielectric loss from the field solver, with laminate Dk/Df across frequency.

Near- and far-end crosstalk between parallel traces from the field solver, with a sweep over the spacing (3W rule check).

Via-pair differential impedance through the plane clearance from a 2D field solution, antipad sizing for a target, stub resonance and delay.

Stitching and fence via pitch from the wavelength (λ/10, λ/20), via-grid cell resonance, leakage between vias and plane-pair cavity resonances.

Impedance, skew, loss budget and length limits of PCIe, USB, Ethernet, HDMI, DDR and other interfaces, applied to a layer of your own stackup with the field solver.

Find stackups by board thickness and layer count, with optional impedance requirements to rank candidates and solve trace widths.

178 fab stackups from 2 to 12 layers, editable, with any signal layer sent to the impedance calculator.

Datasheet Dk and Df of FR-4, low-loss and RF laminates (Isola, Panasonic, Rogers, Shengyi…) at any frequency, plus solder masks and copper foil roughness.

Junction temperature from power and the thermal-resistance chain (θJA or θJC + θCS + θSA), and the maximum power for a Tj limit.

Thermal resistance of a via array under a hot pad, with plugged or filled vias, and the temperature drop through the board.

How much copper a hot part needs: copper-pour thermal resistance by convection and radiation, junction temperature and the smallest pour for a Tj limit.

IPC-2221: width for a current, current for a width, or temperature rise of a trace, with resistance, voltage drop and loss.

Via current capacity, resistance, thermal resistance, capacitance, inductance and rise-time impact.

Skin depth in copper and the AC resistance of a trace across frequency.

Current that melts a trace in a given time (Onderdonk), for fault and surge analysis.

AWG diameter, area and resistance, cable voltage drop and loss, the smallest gauge for a drop limit, and Preece fusing current.

Minimum electrical clearance between conductors from IPC-2221 Table 6-1: internal, external, coated, high altitude, assemblies.

Minimum clearance and creepage per IEC 60664-1: impulse voltage from mains and overvoltage category, pollution degree, CTI material group, reinforced insulation, altitude.

Target impedance, plane-pair capacitance, decoupling-capacitor resonance and the number of capacitors needed, with a log-log |Z|(f) plot.

Buck power-stage sizing with conduction-mode checks, real inductor and capacitor ratings, IC timing limits and current waveforms across the input range.

Boost power-stage sizing with conduction-mode checks, real inductor and capacitor ratings, IC timing limits and current waveforms across the input range.

Linear regulator dissipation, junction temperature, efficiency and dropout headroom, with the maximum load for a Tj limit.

Standard-value R1/R2 for adjustable regulators: the best E12/E24/E96 pairs, output error, FB bias current and worst case with tolerance.

Inductance of square, hexagonal, octagonal and circular PCB spirals (modified Wheeler and current-sheet models), with DC resistance and Q.

Plated through-hole sizing per IPC-7251 / IPC-2221 / IPC-2222: hole, outer and inner pads, antipad, thermal relief and annular ring for levels A/B/C.

IPC-7351 land diameter for collapsing and non-collapsing BGA balls, with tolerance and courtyard, and escape-routing capacity between lands.

Enter any two of voltage, current, resistance and power to get the other two.

XL and XC at a frequency, LC resonance, the L or C for a target frequency, and series/parallel LC impedance with Q.

Passive RC low-pass and high-pass filters with source/load resistance, standard component selection, tolerance bounds and interactive gain and phase plots.

Crystal load capacitors with the nearest E12/E24 values and resulting CL, plus frequency error ↔ ppm and clock drift.

Voltage divider with best E12/E24/E96 pairs, LED series resistor with power rating, and series/parallel R, C and L.

Matched Pi, T and bridged-T pads with the nearest standard values, their actual loss and return loss, and resistor power.

Save the inputs of every calculator for a board under one name, reopen them later, and export or import them as a project file.

Length, copper weight, temperature, power (dBm/W/V) and frequency/wavelength.

Drill sizes (number, letter, fractional, metric), ISO metric and Unified threads with tap and clearance drills, and the AWG wire table.