Boost Converter Calculator Step-up (boost) converter power stage in continuous conduction: duty cycle, inductor value and ripple current, peak switch current, maximum output current of the IC, output capacitor, ESR ripple and rectifier diode, after TI SLVA372D.
Related power supply tools All calculators Signal integrity Impedance Calculator – Single-ended and differential microstrip, coated and embedded microstrip, stripline and coplanar lines, solved with a 2D field solver.Propagation Delay, εeff & Timing – Propagation delay, length matching from skew, rise time to bandwidth, critical length and wavelength.Trace Loss (Insertion Loss) Calculator – Insertion loss in dB/in and over the full length: conductor loss with copper roughness and dielectric loss from the field solver, with laminate Dk/Df across frequency.Crosstalk Calculator – Near- and far-end crosstalk between parallel traces from the field solver, with a sweep over the spacing (3W rule check).Differential Via – Via-pair differential impedance through the plane clearance from a 2D field solution, antipad sizing for a target, stub resonance and delay.Via Stitching & Via Fence Spacing – Stitching and fence via pitch from the wavelength (λ/10, λ/20), via-grid cell resonance, leakage between vias and plane-pair cavity resonances.Stackup Stackup Advisor – Enter board thickness, layer count and impedance requirements; the field solver ranks every matching fab stackup and gives the trace widths.Layer Stack Manager – 178 fab stackups from 2 to 12 layers, editable, with any signal layer sent to the impedance calculator.PCB Laminate Materials (Dk / Df) – Datasheet Dk and Df of FR-4, low-loss and RF laminates (Isola, Panasonic, Rogers, Shengyi…) at any frequency, plus solder masks and copper foil roughness.Thermal Junction Temperature – Junction temperature from power and the thermal-resistance chain (θJA or θJC + θCS + θSA), and the maximum power for a Tj limit.Thermal Via Array – Thermal resistance of a via array under a hot pad, with plugged or filled vias, and the temperature drop through the board.Copper Area for Heat Spreading – How much copper a hot part needs: copper-pour thermal resistance by convection and radiation, junction temperature and the smallest pour for a Tj limit.Power & conductors Trace Width, Current & Temperature Rise – IPC-2221: width for a current, current for a width, or temperature rise of a trace, with resistance, voltage drop and loss.Via Calculator – Via current capacity, resistance, thermal resistance, capacitance, inductance and rise-time impact.Skin Effect & AC Resistance – Skin depth in copper and the AC resistance of a trace across frequency.Fusing Current – Current that melts a trace in a given time (Onderdonk), for fault and surge analysis.Wire Gauge & Voltage Drop – AWG diameter, area and resistance, cable voltage drop and loss, the smallest gauge for a drop limit, and Preece fusing current.Conductor Spacing (IPC-2221) – Minimum electrical clearance between conductors from IPC-2221 Table 6-1: internal, external, coated, high altitude, assemblies.Creepage & Clearance (IEC 60664-1) – Minimum clearance and creepage per IEC 60664-1: impulse voltage from mains and overvoltage category, pollution degree, CTI material group, reinforced insulation, altitude.Power integrity PDN Impedance Calculator – Target impedance, plane-pair capacitance, decoupling-capacitor resonance and the number of capacitors needed, with a log-log |Z|(f) plot.Power supply Buck Converter Calculator – Step-down converter power stage: duty cycle, inductor and ripple current, peak switch current, input and output capacitors (TI SLVA477B).Boost Converter Calculator – Step-up converter power stage: duty cycle, inductor, peak switch current, maximum output current of the IC and output capacitor (TI SLVA372D).LDO Regulator Power Dissipation – Linear regulator dissipation, junction temperature, efficiency and dropout headroom, with the maximum load for a Tj limit.Feedback Resistor Divider – Standard-value R1/R2 for adjustable regulators: the best E12/E24/E96 pairs, output error, FB bias current and worst case with tolerance.Components Planar Spiral Inductor – Inductance of square, hexagonal, octagonal and circular PCB spirals (modified Wheeler and current-sheet models), with DC resistance and Q.Through-Hole Padstack Calculator – Plated through-hole sizing per IPC-7251 / IPC-2221 / IPC-2222: hole, outer and inner pads, antipad, thermal relief and annular ring for levels A/B/C.BGA Land Pattern – IPC-7351 land diameter for collapsing and non-collapsing BGA balls, with tolerance and courtyard, and escape-routing capacity between lands.Electronics Ohm's Law & Power – Enter any two of voltage, current, resistance and power to get the other two.Reactance & LC Resonance – XL and XC at a frequency, LC resonance, the L or C for a target frequency, and series/parallel LC impedance with Q.Crystal Load Capacitors & PPM – Crystal load capacitors with the nearest E12/E24 values and resulting CL, plus frequency error ↔ ppm and clock drift.Resistor Tools – Voltage divider with best E12/E24/E96 pairs, LED series resistor with power rating, and series/parallel R, C and L.Attenuator Pads – Matched Pi, T and bridged-T pads with the nearest standard values, their actual loss and return loss, and resistor power.Utilities Unit Converter – Length, copper weight, temperature, power (dBm/W/V) and frequency/wavelength.Reference Charts – Drill sizes (number, letter, fractional, metric), ISO metric and Unified threads with tap and clearance drills, and the AWG wire table.