Stackup Advisor Set the board thickness, layer count, fabrication limits and impedance requirements. The field solver designs every line on every candidate stackup and ranks the stackups that meet all requirements.
Related stackup tools All calculators Signal integrity Impedance Calculator – Single-ended and differential microstrip, coated and embedded microstrip, stripline and coplanar lines, solved with a 2D field solver.Propagation Delay, εeff & Timing – Propagation delay, length matching from skew, rise time to bandwidth, critical length and wavelength.Crosstalk Calculator – Near- and far-end crosstalk between parallel traces from the field solver, with a sweep over the spacing (3W rule check).Differential Via – Via-pair differential impedance through the plane clearance from a 2D field solution, antipad sizing for a target, stub resonance and delay.Stackup Stackup Advisor – Enter board thickness, layer count and impedance requirements; the field solver ranks every matching fab stackup and gives the trace widths.Layer Stack Manager – 178 fab stackups from 2 to 12 layers, editable, with any signal layer sent to the impedance calculator.Thermal Junction Temperature – Junction temperature from power and the thermal-resistance chain (θJA or θJC + θCS + θSA), and the maximum power for a Tj limit.Thermal Via Array – Thermal resistance of a via array under a hot pad, with plugged or filled vias, and the temperature drop through the board.Power & conductors Trace Width, Current & Temperature Rise – IPC-2221: width for a current, current for a width, or temperature rise of a trace, with resistance, voltage drop and loss.Via Calculator – Via current capacity, resistance, thermal resistance, capacitance, inductance and rise-time impact.Skin Effect & AC Resistance – Skin depth in copper and the AC resistance of a trace across frequency.Fusing Current – Current that melts a trace in a given time (Onderdonk), for fault and surge analysis.Wire Gauge & Voltage Drop – AWG diameter, area and resistance, cable voltage drop and loss, the smallest gauge for a drop limit, and Preece fusing current.Conductor Spacing (IPC-2221) – Minimum electrical clearance between conductors from IPC-2221 Table 6-1: internal, external, coated, high altitude, assemblies.Power integrity PDN Impedance Calculator – Target impedance, plane-pair capacitance, decoupling-capacitor resonance and the number of capacitors needed, with a log-log |Z|(f) plot.Components Planar Spiral Inductor – Inductance of square, hexagonal, octagonal and circular PCB spirals (modified Wheeler and current-sheet models), with DC resistance and Q.Through-Hole Padstack Calculator – Plated through-hole sizing per IPC-7251 / IPC-2221 / IPC-2222: hole, outer and inner pads, antipad, thermal relief and annular ring for levels A/B/C.BGA Land Pattern – IPC-7351 land diameter for collapsing and non-collapsing BGA balls, with tolerance and courtyard, and escape-routing capacity between lands.Electronics Ohm's Law & Power – Enter any two of voltage, current, resistance and power to get the other two.Reactance & LC Resonance – XL and XC at a frequency, LC resonance, the L or C for a target frequency, and series/parallel LC impedance with Q.Crystal Load Capacitors & PPM – Crystal load capacitors with the nearest E12/E24 values and resulting CL, plus frequency error ↔ ppm and clock drift.Resistor Tools – Voltage divider with best E12/E24/E96 pairs, LED series resistor with power rating, and series/parallel R, C and L.Attenuator Pads – Matched Pi, T and bridged-T pads with the nearest standard values, their actual loss and return loss, and resistor power.Utilities Unit Converter – Length, copper weight, temperature, power (dBm/W/V) and frequency/wavelength.Reference Charts – Drill sizes (number, letter, fractional, metric), ISO metric and Unified threads with tap and clearance drills, and the AWG wire table.